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3D Bump Inspection System
3D surface measurement equipment using the principle of white light interferometry
Multi Head
1~16 (EA)
Substrate Compatibility
100~3000 (mm)
High technology
- Provide measurement software (step height, width, size, etc.)
- Pattern match available
- CAM MASTER utilization features
Process performance
- Productivity improvement through multi-head system
- Maximize Multi head configuration by Mini-Y application
- Enable Multi-faceted measurement through the application of various lens configurations