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Photo Spacer Inspection System
3D surface topography measurement using the principle of white light interferometry – step height and CD measurement of microscopic patterns
Multi Head
1~16 (EA)
Substrate Compatibility
100~3000 (mm)
High technology
- Non-contact 3D surface profilometry
- High-speed measurement
- Multi Head (Max 16), composite head configuration capability
Application
- PS Height and RGB Step Height Difference in CF/Cell/TFT Process
- COA Via Hole depth and step height difference, overlay, etc.